Report overview
Thermosetting Resin Moulding Materials for Electronics resins are used for the manufacturing of printed circuit boards, prepregs and copper clad laminates, amongst Others.
This report aims to provide a comprehensive presentation of the global market for Thermosetting Moulding Materials for Electronics, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thermosetting Moulding Materials for Electronics. This report contains market size and forecasts of Thermosetting Moulding Materials for Electronics in global, including the following market information:
Global Thermosetting Moulding Materials for Electronics Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Thermosetting Moulding Materials for Electronics Market Sales, 2018-2023, 2024-2029, (K MT)
Global top five Thermosetting Moulding Materials for Electronics companies in 2022 (%)
The global Thermosetting Moulding Materials for Electronics market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
With rise in demand for lighter, shorter, thermally stable and reliable circuit boards, Thermosetting Resin Moulding Materials for Electronics are gaining prominence in the digital world. Owing to good adhesion, high electrical insulation and mechanical and thermal stability properties of Thermosetting Resin Moulding Materials for Electronics resins, their use has grown significantly over the past decade.
We surveyed the Thermosetting Moulding Materials for Electronics manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thermosetting Moulding Materials for Electronics Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K MT)
Global Thermosetting Moulding Materials for Electronics Market Segment Percentages, by Type, 2022 (%)
Epoxy
Polyester
Polyurethane
Polyimide
Bakelite
Formaldehyde
Others
Global Thermosetting Moulding Materials for Electronics Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K MT)
Global Thermosetting Moulding Materials for Electronics Market Segment Percentages, by Application, 2022 (%)
Automotive
Consumer Electronics
Aerospace
Others
Global Thermosetting Moulding Materials for Electronics Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K MT)
Global Thermosetting Moulding Materials for Electronics Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Thermosetting Moulding Materials for Electronics revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Thermosetting Moulding Materials for Electronics revenues share in global market, 2022 (%)
Key companies Thermosetting Moulding Materials for Electronics sales in global market, 2018-2023 (Estimated), (K MT)
Key companies Thermosetting Moulding Materials for Electronics sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
BASF
Cosmic Plastics
Eastman
Hitachi
Huntsman
Evonik
Momentive
Kolon industries
Plastics Engineering Company (Plenco)
KYOCERA
Outline of Major Chapters:
Chapter 1: Introduces the definition of Thermosetting Moulding Materials for Electronics, market overview.
Chapter 2: Global Thermosetting Moulding Materials for Electronics market size in revenue and volume.
Chapter 3: Detailed analysis of Thermosetting Moulding Materials for Electronics manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Thermosetting Moulding Materials for Electronics in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Thermosetting Moulding Materials for Electronics capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.