The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2018 to 2029. by Application segment also provides consumption during the forecast period of 2018 to 2029. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
Die Bonders
Flip Chip Bonders
Segment by Application
LED
Optoelectronics
RF
Logic
Discrete
Memory
Stached Memory
Other
By Company
Besi
ASM Pacific Technology (ASMPT)
Shinkawa
Hoson
Ficontec
Panasoic
Shibaura
Four Technos
Palomar
Fastford
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
