Report overview
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
This report aims to provide a comprehensive presentation of the global market for Electronic Potting & Encapsulating, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Potting & Encapsulating. This report contains market size and forecasts of Electronic Potting & Encapsulating in global, including the following market information:
Global Electronic Potting & Encapsulating Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Electronic Potting & Encapsulating Market Sales, 2018-2023, 2024-2029, (K MT)
Global top five Electronic Potting & Encapsulating companies in 2022 (%)
The global Electronic Potting & Encapsulating market was valued at US$ 1855.8 million in 2022 and is projected to reach US$ 3370.8 million by 2029, at a CAGR of 8.9% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Henkel, Dow Corning and Hitachi Chemical are the top 3 players of Electronic Potting & Encapsulating, with about 50% market shares.
We surveyed the Electronic Potting & Encapsulating manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Electronic Potting & Encapsulating Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K MT)
Global Electronic Potting & Encapsulating Market Segment Percentages, by Type, 2022 (%)
Silicones
Epoxy
Polyurethane
Others
Global Electronic Potting & Encapsulating Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K MT)
Global Electronic Potting & Encapsulating Market Segment Percentages, by Application, 2022 (%)
Consumer Electronics
Automotive
Medical
Telecommunications
Others
Global Electronic Potting & Encapsulating Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K MT)
Global Electronic Potting & Encapsulating Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Electronic Potting & Encapsulating revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Electronic Potting & Encapsulating revenues share in global market, 2022 (%)
Key companies Electronic Potting & Encapsulating sales in global market, 2018-2023 (Estimated), (K MT)
Key companies Electronic Potting & Encapsulating sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
Outline of Major Chapters:
Chapter 1: Introduces the definition of Electronic Potting & Encapsulating, market overview.
Chapter 2: Global Electronic Potting & Encapsulating market size in revenue and volume.
Chapter 3: Detailed analysis of Electronic Potting & Encapsulating manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Electronic Potting & Encapsulating in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Electronic Potting & Encapsulating capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
